Title:
LASER PEELING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/074065
Kind Code:
A1
Abstract:
A laser peeling device that uses laser light to irradiate a workpiece comprising a substrate and a release layer formed on the substrate, thereby peeling the release layer from the substrate, said laser peeling device comprising an imaging device for capturing an image of the workpiece irradiated by the laser light, and a processing unit for carrying out a process based on an image captured by the imaging device, wherein the processing unit: derives information about the state of the release layer by acquiring an image of the workpiece captured by the imaging device, and inputting the acquired workpiece image to a learning model that outputs information about the state of a release layer of a workpiece when an image of the workpiece is input; and outputs the derived information about the state of the release layer.
Inventors:
MATSUSHITA REI (JP)
OHMORI KENICHI (JP)
OKU NOBUO (JP)
ODAJIMA TAMOTSU (JP)
OHTA YUZABURO (JP)
OHMORI KENICHI (JP)
OKU NOBUO (JP)
ODAJIMA TAMOTSU (JP)
OHTA YUZABURO (JP)
Application Number:
PCT/JP2022/028013
Publication Date:
May 04, 2023
Filing Date:
July 19, 2022
Export Citation:
Assignee:
JSW AKTINA SYSTEM CO LTD (JP)
International Classes:
B23K26/00; B23K26/57; H01L21/304
Foreign References:
| JP2018199163A | 2018-12-20 | |||
| JP2001013079A | 2001-01-19 | |||
| JP2010161285A | 2010-07-22 | |||
| JP2017196665A | 2017-11-02 | |||
| US20140251533A1 | 2014-09-11 |
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
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