Title:
LASER PEENING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/021539
Kind Code:
A1
Abstract:
The laser peening device relating to an embodiment of the present invention is provided with a laser oscillator that oscillates laser light, and an irradiation system, which collects the laser light by means of a lens, and which applies the laser light to a subject to be machined, said irradiation system being configured so as to apply the laser light to the subject in a state wherein the subject is exposed to the atmosphere without having a liquid therebetween. Furthermore, a laser peening method relating to an embodiment of the present invention is provided for the purpose of manufacturing a product or a semifinished product by performing, using the laser peening device, the laser peening with respect to the subject.
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Inventors:
NAKANO MAYU (JP)
ADACHI TAKAFUMI (JP)
ADACHI TAKAFUMI (JP)
Application Number:
PCT/JP2018/014453
Publication Date:
January 31, 2019
Filing Date:
April 04, 2018
Export Citation:
Assignee:
SUBARU CORP (JP)
International Classes:
B23K26/356; B23K26/00; B23K26/16
Foreign References:
JP2015093284A | 2015-05-18 | |||
JP2016538421A | 2016-12-08 | |||
JP2004160463A | 2004-06-10 | |||
JP2010247213A | 2010-11-04 | |||
JP2010247213A | 2010-11-04 | |||
JP2014176870A | 2014-09-25 |
Other References:
See also references of EP 3659739A4
Attorney, Agent or Firm:
YAMADA, Takehiko (JP)
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