Title:
LASER PROCESSING APPARATUS, LASER PROCESSING METHOD AND PHOTO-ELECTROMOTIVE FORCE APPARATUS MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/070940
Kind Code:
A1
Abstract:
Disclosed is an apparatus comprising: feed means that feeds a workpiece in a first direction with a fixed speed, holding the workpiece with the surface to be processed upwards; a laser oscillator that emits a pulsed laser beam; splitting means that branches the pulsed laser beam in a periodic pattern having a fixed periodic structure; first deflection means that scans the branched pulsed laser beam in a direction substantially perpendicular to the first direction; second deflection means that scans a pulsed laser beam deflected and branched by the first deflection means with a fixed speed equal to the speed of feeding of the workpiece with respect to the surface to be processed, adjusting and deflecting the pulsed laser beam in the first direction on the surface to be processed; and focusing means that focuses the pulsed laser beam deflected and branched by the second deflection means on the surface to be processed. A periodic pattern is thus produced by processing by the division means at each pulse.
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Inventors:
KATSURA TOMOTAKA (JP)
OKAMOTO TATSUKI (JP)
NISHIMURA KUNIHIKO (JP)
OKAMOTO TATSUKI (JP)
NISHIMURA KUNIHIKO (JP)
Application Number:
PCT/JP2009/057917
Publication Date:
June 24, 2010
Filing Date:
April 21, 2009
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
KATSURA TOMOTAKA (JP)
OKAMOTO TATSUKI (JP)
NISHIMURA KUNIHIKO (JP)
KATSURA TOMOTAKA (JP)
OKAMOTO TATSUKI (JP)
NISHIMURA KUNIHIKO (JP)
International Classes:
B23K26/00; B23K26/067; B23K26/08; B23K26/38; H01S3/00; B23K101/40
Foreign References:
| JP2008012546A | 2008-01-24 | |||
| JP2002111022A | 2002-04-12 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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