Title:
LASER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/129282
Kind Code:
A1
Abstract:
Disclosed is a laser processing apparatus wherein a subject to be processed can be quickly carried in/out without disposing a load lock chamber or the like in the laser processing apparatus, and, furthermore, the atmosphere in the processing chamber can be stabilized in a short time.
The laser processing apparatus is provided with: the processing chamber (2), which contains the subject to be processed (100), and which radiates laser light to the subject (100) under adjusted atmosphere; and an optical system, which guides the laser light into the processing chamber (2) from the outside. The processing chamber (2) has an openable/closable loading entrance (7), through which the subject (100) is loaded in the processing chamber (2) from the outside of the processing chamber (2), and in the processing chamber (2), a load area (A) continuous from the loading entrance (7), and a laser light irradiation area (B) continuous from the load area (A) are provided. The processing chamber also has a partitioning section that partitions the load area (A) into a space (A1) on the loading entrance side, and a space (A2) on the laser light irradiation area side. The partitioning section permits the subject (100) to move between the space (A1) on the loading entrance side, and the space (A2) on the laser light irradiation area side.
Inventors:
MATSUSHIMA TATSURO (JP)
ITO DAISUKE (JP)
SAZUKA HIROTAKA (JP)
TOKIHISA MASAYOSHI (JP)
TAGO YOUSUKE (JP)
SHIMIZU RYO (JP)
ITO DAISUKE (JP)
SAZUKA HIROTAKA (JP)
TOKIHISA MASAYOSHI (JP)
TAGO YOUSUKE (JP)
SHIMIZU RYO (JP)
Application Number:
PCT/JP2011/058929
Publication Date:
October 20, 2011
Filing Date:
April 08, 2011
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD (JP)
MATSUSHIMA TATSURO (JP)
ITO DAISUKE (JP)
SAZUKA HIROTAKA (JP)
TOKIHISA MASAYOSHI (JP)
TAGO YOUSUKE (JP)
SHIMIZU RYO (JP)
MATSUSHIMA TATSURO (JP)
ITO DAISUKE (JP)
SAZUKA HIROTAKA (JP)
TOKIHISA MASAYOSHI (JP)
TAGO YOUSUKE (JP)
SHIMIZU RYO (JP)
International Classes:
H01L21/268; H01L21/20
Foreign References:
| JP2006147859A | 2006-06-08 | |||
| JPH1197382A | 1999-04-09 | |||
| JP2000021891A | 2000-01-21 | |||
| JPH10308357A | 1998-11-17 | |||
| JPH04356917A | 1992-12-10 |
Attorney, Agent or Firm:
YOKOI Koki (JP)
Koki Yokoi (JP)
Koki Yokoi (JP)
Download PDF:
Claims:
Previous Patent: CU-SI-CO ALLOY FOR ELECTRONIC MATERIALS, AND METHOD FOR PRODUCING SAME
Next Patent: PARTITION REPAIR METHOD
Next Patent: PARTITION REPAIR METHOD