Title:
LASER PROCESSING DEVICE, LASER PROCESSING METHOD, AND RECOVERY MECHANISM
Document Type and Number:
WIPO Patent Application WO/2024/062821
Kind Code:
A1
Abstract:
Provided is a laser processing device capable of efficiently recovering a product even when a laser head is moved back and forth. This laser processing device comprises: the laser head that irradiates a workpiece with laser light; and a recovery mechanism that recovers a product by emission of the laser light. The recovery mechanism comprises: a first recovery unit provided with a first air supply nozzle that supplies a scavenging gas, and a first suction duct provided facing the first air supply nozzle; and a second recovery unit provided with a second air supply nozzle that supplies a scavenging gas, and a second suction duct provided facing the second air supply nozzle.
Inventors:
SHIOTANI SHIGETOSHI (JP)
YONEDA JIRO (JP)
NARITA RYUICHI (JP)
GOYA SANEYUKI (JP)
ASANO SHIN (JP)
SUGIURA ATSUSHI (JP)
YONEDA JIRO (JP)
NARITA RYUICHI (JP)
GOYA SANEYUKI (JP)
ASANO SHIN (JP)
SUGIURA ATSUSHI (JP)
Application Number:
PCT/JP2023/030141
Publication Date:
March 28, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B23K26/16
Domestic Patent References:
| WO2021004641A1 | 2021-01-14 |
Foreign References:
| JPS62179888A | 1987-08-07 | |||
| JP2008114252A | 2008-05-22 | |||
| JP2016087639A | 2016-05-23 |
Attorney, Agent or Firm:
OBA, Mitsuru et al. (JP)
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