LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

Title:

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

Document Type and Number:

WIPO Patent Application WO/2012/057025

Kind Code:

A1

Abstract:

Provided is a laser processing device comprising: a processing head; a plate-shaped workpiece processing table for processing plate-shaped workpieces; a rod-shaped workpiece processing table for processing rod-shaped workpieces, comprising a rod-shaped workpiece gripping section; and a processing region with the processing head disposed moveably therein. The plate-shaped workpiece processing table is disposed so as to be movable from one side of the processing region to the processing region. The rod-shaped workpiece processing table is disposed so as to be movable from another side of the processing region, which is opposite to the one side of the processing region, to the processing region. The laser processing device can not only make the plate-shaped workpiece processing table and the rod-shaped workpiece processing table move to and retreat from the processing area, the device can also easily perform switching work.

Inventors:

NISHIYAMA HARUMI (JP)
ONODERA HIROSHI (JP)
ADACHI MASAKI (JP)

Application Number:

PCT/JP2011/074301

Publication Date:

May 03, 2012

Filing Date:

October 21, 2011

Export Citation:

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Assignee:

AMADA CO LTD (JP)
NISHIYAMA HARUMI (JP)
ONODERA HIROSHI (JP)
ADACHI MASAKI (JP)
ABE TOSHINORI (JP)

International Classes:

B23K26/10; B23K37/04; B23K37/047; B23K37/053; B23K7/10

Foreign References:

JPH10175086A	1998-06-30
JPH1099985A	1998-04-21
JPH05309490A	1993-11-22
JPH0780676A	1995-03-28
JPH07148591A	1995-06-13
JPH07148592A	1995-06-13
JPH1058182A	1998-03-03
JPH10296358A	1998-11-10
JP2006026758A	2006-02-02
JP2010201465A	2010-09-16
JP2001150175A	2001-06-05

Other References: