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Patent Searching and Data


Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/058072
Kind Code:
A1
Abstract:
[Problem] To provide a laser processing device and laser processing method that can improve the degree of roughness of the cutting surface in laser cutting treatment that uses laser transmitted by an optical fiber. [Solution] This laser processing device is provided with: at least one laser oscillator that outputs a laser beam; a plurality of optical fibers that transmit the laser beam that is output; and at least one optical element that converges and radiates the laser beams output by the optical fibers onto a surface of material to be processed. The output ends of the plurality of optical fibers are disposed on one or a plurality of circular shapes, and the laser beams transmitted by the plurality of optical fibers disposed in a circular shape at least at the outer periphery is linear polarized light. The polarization orientations of the linear polarized laser beams output by the output ends of the plurality of optical fibers are aligned in a radial shape with the center of the circle at the outermost periphery as a reference.

Inventors:
HIRANO KOJI (JP)
IMAI HIROFUMI (JP)
Application Number:
PCT/JP2012/074714
Publication Date:
April 25, 2013
Filing Date:
September 26, 2012
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
B23K26/073; B23K26/08; B23K26/38; H01S3/00; H01S3/13
Foreign References:
JP2003154477A2003-05-27
JP4505190B22010-07-21
JP2010508149A2010-03-18
JP2010194558A2010-09-09
JP2007065280A2007-03-15
JP2009525189A2009-07-09
JP4505190B22010-07-21
JP2010508149A2010-03-18
Other References:
See also references of EP 2722127A4
P. A. HILTON: "Cutting Stainless Steel with Disc and C02 Lasers", PROCEEDINGS OF LAMP2009 - THE 5TH INTERNATIONAL CONGRESS ON LASER ADVANCED MATERIALS PROCESSING, 2009
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
Yoshiaki Kameya (JP)
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Claims: