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Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/188518
Kind Code:
A1
Abstract:
This laser processing device forms, on a principal surface of a substrate retained by a substrate retention unit, an radiation point of a laser beam for processing the substrate, and forms a processing trace by moving the radiation point over a planned dividing line of the substrate, wherein the laser processing device includes a processing unit for repeating, while changing the planned dividing line, movement of the substrate retention unit in a first axial direction in order to move the radiation point over the planned dividing line, and rotating the substrate retention unit midway about a third axis, thereby changing the orientation of the substrate retained by the substrate retention unit by 180°.

Inventors:
MORI, Hirotoshi (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
KAWAGUCHI, Yoshihiro (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
TANOUE, Hayato (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
HISANO, Kazuya (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
Application Number:
JP2019/011231
Publication Date:
October 03, 2019
Filing Date:
March 18, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
International Classes:
H01L21/301; B23K26/08; B23K26/364; B23K26/53
Domestic Patent References:
WO2004105109A12004-12-02
Foreign References:
JP2017163079A2017-09-14
JPH09199448A1997-07-31
JPS6374605A1988-04-05
Attorney, Agent or Firm:
ITOH, Tadashige et al. (16th Floor, Marunouchi MY PLAZA 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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