Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/014618
Kind Code:
A1
Abstract:
This laser processing device comprises an irradiation unit and a control unit. The irradiation unit has a spatial light modulator and a focusing unit that focuses a laser modulated by the spatial light modulator on an object. The control unit executes a first control for causing the laser to be modulated by the spatial light modulator such that the laser splits into a plurality of processing lights, and a plurality of focal points of the plurality of processing lights are positioned in mutually different locations in a direction orthogonal to the irradiation direction of the laser. In the first control, the laser is modulated such that, in the irradiation direction, the respective focal points of the plurality of processing lights are positioned on an opposite side from a focal point of a non-modulated light from the laser with respect to ideal focal points of the processing lights, or such that the respective focal points of the plurality of processing lights are positioned on an opposite side from the ideal focal points of the processing lights with respect to the focal point of the non-modulated light.
Inventors:
SAKAMOTO TAKESHI (JP)
KOREMATSU KATSUHIRO (JP)
OGIWARA TAKAFUMI (JP)
KOREMATSU KATSUHIRO (JP)
OGIWARA TAKAFUMI (JP)
Application Number:
PCT/JP2021/026366
Publication Date:
January 20, 2022
Filing Date:
July 13, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/046; B23K26/067; B23K26/53; H01L21/301
Domestic Patent References:
| WO2014156688A1 | 2014-10-02 |
Foreign References:
| JP2011051011A | 2011-03-17 | |||
| JP2011206850A | 2011-10-20 | |||
| JP2010260063A | 2010-11-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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