Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/091721
Kind Code:
A1
Abstract:
Provided are a laser processing device and a laser processing method which can both maintain the processing quality of a processed groove and prevent an increase in tact time. The present invention comprises: a branching element which branches second laser light into a plurality of branched light along a processing feed direction; and a second condenser lens which condenses the plurality of branched light branched by the branching element into a street to be processed, wherein, when defining a branching distance as L, which is the interval between a mutually adjacent preceding spot and following spot in spots for each branched light condensed onto the street by the second condenser lens, the processing speed as V, which is the speed of relative movement, and the time until the following spot overlaps a processing position of the preceding spot as τ, time is expressed by τ=L/V, and when the threshold value of a time at which a worsening of the processing quality of the second groove occurs is defined as τ1, τ>τ1 is satisfied.
Inventors:
AIKAWA CHIKARA (JP)
HAYASHI HIROKAZU (JP)
HAYASHI HIROKAZU (JP)
Application Number:
PCT/JP2021/036929
Publication Date:
May 05, 2022
Filing Date:
October 06, 2021
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
B23K26/067; B23K26/364; H01L21/301
Domestic Patent References:
| WO2015137179A1 | 2015-09-17 |
Foreign References:
| JP2015154009A | 2015-08-24 | |||
| JP2013180295A | 2013-09-12 | |||
| JP2017177194A | 2017-10-05 | |||
| JP2015167969A | 2015-09-28 | |||
| JP2009182019A | 2009-08-13 | |||
| JP2016208035A | 2016-12-08 |
Other References:
See also references of EP 4238686A4
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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