Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/210715
Kind Code:
A1
Abstract:
This laser processing device comprises: a laser light source unit that irradiates, with a laser beam, the surface of a steel plate being transported in a preset transport direction; a gas injection unit that injects first gas parallel to the optical axis direction of the laser beam toward the irradiation site of the laser beam; a dust collection mechanism unit that is provided either upstream or downstream of the irradiation site in the transport direction and collects laser spatter generated from the irradiation site from a dust collection port; and a gas supply unit that is disposed on the opposite side to the dust collection mechanism unit across the laser light source unit in the transport direction, and that supplies gas between the gas supply unit and the steel plate.
Inventors:
YAMADA YOSHIHIRO (JP)
Application Number:
PCT/JP2023/016554
Publication Date:
November 02, 2023
Filing Date:
April 26, 2023
Export Citation:
Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C21D8/12; B23K26/142; B23K26/16; B23K26/36; H01F1/16
Domestic Patent References:
| WO2018025495A1 | 2018-02-08 |
Foreign References:
| JP2001518018A | 2001-10-09 | |||
| JP4433708B2 | 2010-03-17 | |||
| JPH01114188U | 1989-08-01 | |||
| JPH08192289A | 1996-07-30 | |||
| JP5824998B2 | 2015-12-02 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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