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Title:
LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/244484
Kind Code:
A1
Abstract:
A laser processing device (1) comprising: a laser oscillator (2) that emits laser light; a processing head (4) having an optical system for focusing the laser light on a workpiece (11); a drive unit (5) for controlling the relationship of the relative positions of the workpiece (11) and the processing head (4); a control device (6) for controlling the laser oscillator (2) and the drive unit (5) such that the laser light scans a processing path on the workpiece (11) according to a set processing condition; a detection unit (7) for observing the state of the workpiece (11) during processing, and outputting an observation result as a time-series signal; a processing state observation unit (8) for evaluating the processing state of the workpiece (11) on the basis of the time-series signal for each of a plurality of segments into which the processing path has been divided, and thereby obtaining evaluation information that includes a determination result indicating whether the state is suitable or defective; and an inference unit (10) for inferring a cause of a defect, on the basis of the evaluation information for two or more segments that include a segment for which the determination result indicates a defect.

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Inventors:
FUJII KENTA (JP)
NISHIWAKI MOTOAKI (JP)
TANAKA NOBUAKI (JP)
SEGUCHI MASAKI (JP)
ISHIKAWA KYOHEI (JP)
Application Number:
PCT/JP2019/017981
Publication Date:
December 26, 2019
Filing Date:
April 26, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/00
Foreign References:
JP2000271768A2000-10-03
JP2007253220A2007-10-04
JPH11188489A1999-07-13
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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