Title:
LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/019704
Kind Code:
A1
Abstract:
This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.
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Inventors:
YOSHIDA KAZUHIRO (JP)
KOMATSU YOSHINAO (JP)
GOYA SANEYUKI (JP)
INOUE AKIKO (JP)
FUJIYA YASUYUKI (JP)
NARITA RYUICHI (JP)
SHIMIZU MASAHIKO (JP)
KOMATSU YOSHINAO (JP)
GOYA SANEYUKI (JP)
INOUE AKIKO (JP)
FUJIYA YASUYUKI (JP)
NARITA RYUICHI (JP)
SHIMIZU MASAHIKO (JP)
Application Number:
PCT/JP2019/029934
Publication Date:
February 04, 2021
Filing Date:
July 31, 2019
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B23K26/142
Foreign References:
| JP2002524263A | 2002-08-06 | |||
| JP2014226706A | 2014-12-08 | |||
| JP2000225486A | 2000-08-15 | |||
| JPH1099978A | 1998-04-21 | |||
| JP2011036865A | 2011-02-24 |
Other References:
See also references of EP 3943230A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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