Title:
LASER PROCESSING MACHINE, AND METHOD FOR ADJUSTING ALIGNMENT OF LASER PROCESSING MACHINE AT CLIENT DESTINATION
Document Type and Number:
WIPO Patent Application WO/2020/136928
Kind Code:
A1
Abstract:
Provided is a class 1 laser processing machine comprising a laser oscillator capable of radiating class 4 infrared laser light, it being possible to (maintain/service) the laser processing machine in a class 1 environment in a state in which a machining space is exposed. This laser processing machine 1 comprises: a laser oscillator 71 provided inside a machining body 1 that can be opened and closed, the laser oscillator 71 irradiating a workpiece that is disposed inside the machining body 1 with infrared laser light through a laser path P1 inside the machining body 1; a laser pointer 73 that radiates visible laser light; a plurality of laser-beam-integration-adjusting mechanisms 37 that coaxializes (integrates) the laser light from the laser pointer 73 on the laser path P1; and a non-laser-irradiable part EC, Co that cannot be irradiated with infrared laser light from the laser oscillator 71 when the machining body 1 is in an opened state.
Inventors:
MIAO YIFENG (JP)
ZHANG XIN (CN)
WANG CHAO (CN)
ZHANG XIN (CN)
WANG CHAO (CN)
Application Number:
PCT/JP2019/011916
Publication Date:
July 02, 2020
Filing Date:
March 20, 2019
Export Citation:
Assignee:
MAANSHAN CITY MINGZHU ELECTRONIC TECH COMPANY LIMITED (CN)
OH LASER CO LTD (JP)
OH LASER CO LTD (JP)
International Classes:
B23K26/08; B23K26/035; B23K26/70; G02B5/08
Foreign References:
| JP2015123452A | 2015-07-06 | |||
| JP2017226014A | 2017-12-28 | |||
| JPS6334589U | 1988-03-05 | |||
| JPH07116878A | 1995-05-09 | |||
| JPS6316587U | 1988-02-03 | |||
| JPH04231189A | 1992-08-20 |
Attorney, Agent or Firm:
SHIBA Tetsuo et al. (JP)
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