Title:
LASER PROCESSING MACHINE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/176292
Kind Code:
A1
Abstract:
A beam displacement mechanism causes the position of a laser beam, emitted via an opening (36a) of a nozzle (36), to be displaced in the opening (36a). An assist gas supply device (80) supplies an assist gas to a processing head (35) during processing of a metal sheet (W). A control device (NC device 50), when implementing a piercing process outside a product, controls the beam displacement mechanism so that the position of the laser beam in the opening (36a) is displaced from the center of the opening (36a) to a position in a direction away from the product. The control device, when cutting the outline of the product, controls the beam displacement mechanism so that the position of the laser beam in the opening (36a) is displaced from the center of the opening (36a) toward the front in a cutting proceeding direction.
Inventors:
YAMANASHI TAKAAKI (JP)
FUNAKI KOJI (JP)
FUNAKI KOJI (JP)
Application Number:
PCT/JP2019/001944
Publication Date:
September 19, 2019
Filing Date:
January 23, 2019
Export Citation:
Assignee:
AMADA HOLDINGS CO LTD (JP)
International Classes:
B23K26/38; B23K26/082; B23K26/382
Domestic Patent References:
| WO2015156119A1 | 2015-10-15 |
Foreign References:
| JP2012187606A | 2012-10-04 | |||
| JPH07308792A | 1995-11-28 | |||
| JPH06170578A | 1994-06-21 | |||
| JP2005279730A | 2005-10-13 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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