Title:
LASER PROCESSING MACHINE AND WORKPIECE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/119836
Kind Code:
A1
Abstract:
[Problem] When a hole is to be formed by boring, it is desirable to detect whether or not pieces of slag remain in the hole prior to performing secondary processing on said hole. [Solution] This laser processing machine may be provided with a secondary processing tool for performing secondary processing on a hole. The laser processing machine may be provided with an imaging unit for capturing an image of a plate surface of a workpiece being transferred by a transfer device. The laser processing machine may be provided with an image processing unit for performing image processing on an image captured by the imaging unit. The transfer device may be configured to be capable of transferring a workpiece having undergone boring, to a position where secondary processing is to take place. The imaging unit may be disposed at a position from where an image, of a plate surface of the workpiece on a path through which the workpiece is transferred by the transfer device, can be captured, and may capture an image of the plate surface of the workpiece in the course of being transferred by the transfer device. The image processing unit may determine whether pieces of slag are remaining in the hole, by performing image processing on the image captured by the imaging unit.
Inventors:
KAWAI HIDETSUGU (JP)
Application Number:
PCT/JP2022/039292
Publication Date:
June 29, 2023
Filing Date:
October 21, 2022
Export Citation:
Assignee:
MURATA MACHINERY LTD (JP)
International Classes:
B23K26/382; B23K26/00; B23K26/08; B23K26/10; B23K26/70
Foreign References:
| JP2016165791A | 2016-09-15 | |||
| JP2010094741A | 2010-04-30 | |||
| JP2018183793A | 2018-11-22 | |||
| JP2013202723A | 2013-10-07 | |||
| JP2018089632A | 2018-06-14 |
Attorney, Agent or Firm:
NISHI, Kazuya (JP)
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