Title:
LASER PROCESSING MACHINE
Document Type and Number:
WIPO Patent Application WO/2018/029842
Kind Code:
A1
Abstract:
A laser processing machine (1) irradiates focused laser light (L) onto a workpiece (W) to cut the workpiece (W). The laser processing machine (1) is provided with: a workpiece supporting unit (10) which supports the workpiece (W); and a processing head (20) which irradiates the focused laser light (L) onto the workpiece (W) and emits an auxiliary gas (AG). The laser processing machine (1) is provided with: a thin wire inserting unit (50) which is attached to the processing head (20) and which is capable of inserting into a pierced hole (PH) or a cut groove formed in the workpiece (W) a thin wire (51) which reflects the laser light (L); and a control device (40). The control device (40) controls the thin wire inserting unit (50) during the cutting process, to insert the thin wire (51) into the pierced hole (PH) and the cut groove to the rear of an irradiation point (SP) with respect to a cutting progress direction (MD) resulting from movement of at least one of the workpiece supporting unit (10) and the processing head (20).
Inventors:
NAKAMURA NAOYUKI (JP)
KUROSAKI YOSHIHARU (JP)
KUROSAKI YOSHIHARU (JP)
Application Number:
PCT/JP2016/073675
Publication Date:
February 15, 2018
Filing Date:
August 10, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/38
Foreign References:
| JP2003170289A | 2003-06-17 | |||
| JPH07100683A | 1995-04-18 | |||
| JP2001013452A | 2001-01-19 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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