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Patent Searching and Data


Title:
LASER PROCESSING MACHINE
Document Type and Number:
WIPO Patent Application WO/2019/111428
Kind Code:
A1
Abstract:
The objective of the invention is to provide a laser processing machine having, integrated into the device main body of a small laser processing machine for household use, a Peltier element that cools a cooling medium for cooling a laser oscillator. The laser processing machine 1 comprises: the device main body 10; a laser oscillator 71 housed inside the device main body 10; a cooling medium flow path disposed inside the device main body 10, wherethrough the cooling medium for cooling the laser oscillator 71 circulates; and a cooling device 45 provided with a Peltier element for cooling the cooling medium circulating in the cooling medium flow path. The cooling device 45 has connected thereto thermal radiation fins 621 for thermally radiating the heat generated in the Peltier element. An exhaust port 121 exhausts the air inside the device main body 10 to the outside of the device main body 10, and the thermal radiation fins 621 are disposed on the side directly upstream of the exhaust port 121 in the context of the flow of air toward the exhaust port 121.

Inventors:
MYO Itsuho (94-2, Onakai, Kawagoe-sh, Saitama 21, 〒3500021, JP)
Application Number:
JP2018/013953
Publication Date:
June 13, 2019
Filing Date:
March 30, 2018
Export Citation:
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Assignee:
MAANSHAN CITY MINGZHU ELECTRONIC TECHNOLOGY COMPANY LIMITED (UNIT 5, NO. 1669 NORTH HUOLISHAN ROAD, CIHU HIGH-TECH ZONE, MA'ANSHAN CIT, ANHUI 1, 243051, CN)
OH-LASER CO., LTD. (94-2, Oaza Onakai Kawagoe-sh, Saitama 21, 〒3500021, JP)
International Classes:
H01S3/041; B23K26/00; B23K26/70; H01S3/00
Attorney, Agent or Firm:
SHIBA Tetsuo et al. (Sapia Tower, 1-7-12 Marunouchi, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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