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Title:
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/125799
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a method and an apparatus for efficiently performing processing, even in the case of applying laser beams having different intensities and wavelengths at a plurality of stages in patterning of an electronic circuit board. [MEANS FOR SOLVING PROBLEMS] A laser processing apparatus is provided with first and second laser oscillators (2a, 2b) for applying laser beams (3a, 3b) of which at least the wavelength or the intensities are different from each other; a stage apparatus (5) for moving a subject (1) to be processed; and optical systems (4a, 4b) for guiding the laser beams (3a, 3b) to prescribed positions of the subject (1). The optical systems (4a, 4b) can be moved by a movable apparatus (6), corresponding to the relative moving direction of the laser beams (3a, 3b) and the subject (1) to permit the prescribed position of the subject (1) to be irradiated with laser beams (3a, 3b) in this order so that the subject (1) can be processed by the laser beams (3a, 3b). Thus, efficient laser processing can be performed without limiting the laser beams and the subject in the relative moving direction and without unnecessary movement.

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Inventors:
FUKUDA NAOAKI (JP)
KUNISHIO KAZUYOSHI (JP)
NAKAYAMA SHIGEAKI (JP)
Application Number:
PCT/JP2007/058439
Publication Date:
November 08, 2007
Filing Date:
April 18, 2007
Export Citation:
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Assignee:
HITACHI SHIPBUILDING ENG CO (JP)
FUKUDA NAOAKI (JP)
KUNISHIO KAZUYOSHI (JP)
NAKAYAMA SHIGEAKI (JP)
International Classes:
B23K26/06; H05K3/00; H05K3/08; B23K101/42
Domestic Patent References:
WO2000064623A12000-11-02
Foreign References:
JPH09300087A1997-11-25
JPH1034364A1998-02-10
JPH10277763A1998-10-20
JPH10277764A1998-10-20
JP2005238291A2005-09-08
JPH10314973A1998-12-02
JP2002219590A2002-08-06
US20030006221A12003-01-09
Other References:
See also references of EP 2011599A4
Attorney, Agent or Firm:
MIZOGAMI, Mitsuyoshi et al. (1-10-4 Utsubo-Hommachi,Nishi-ku, Osaka-shi, Osaka 04, JP)
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