Title:
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/225362
Kind Code:
A1
Abstract:
Provided is a laser processing device and a laser processing method that can make the processing depth uniform and can prevent damage to lower layer material because of laser beam overlapping and occurrences of film growth residue when removal processing is performed on a thin film by laser beam irradiation of the surface of an article to be processed whereon the thin film is formed. Specifically, when removal processing is performed on the thin film by laser beam irradiation of the surface of the article to be processed whereon the thin film is formed, the laser beam is formed into a main beam part set to an amount of energy sufficient for the removal processing of the thin film and a sub-beam part arranged parallel to the main beam and set to an amount of energy lower than the main beam. While moving the laser beam relatively, the leading sub-beam part and the following sub-beam part are overlapped, and the accumulated amount of energy for the main beam part and the accumulated amount of energy for the sub-beam part that is overlapped are set within a prescribed range.
Inventors:
MORI EIJI (JP)
SAHASHI KEIICHI (JP)
KANAZAWA MASAHIRO (JP)
SAHASHI KEIICHI (JP)
KANAZAWA MASAHIRO (JP)
Application Number:
PCT/JP2018/014366
Publication Date:
December 13, 2018
Filing Date:
April 04, 2018
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B23K26/36; B23K26/062; B23K26/073
Foreign References:
| JPH09327782A | 1997-12-22 | |||
| JP2000042763A | 2000-02-15 |
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