Title:
LASER PROCESSING METHOD AND DEVICE, AND PROCESSED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2005/007335
Kind Code:
A1
Abstract:
A laser processing method capable of easily cutting an object to be cut. The laser processing method has a step of focusing and irradiating a laser beam on a collecting point inside an object (1) to be processed, forming portions (7, 13) to be treated inside the object along a to-be-cut line of the object by multiphoton absorption, and forming micro-cavities (8) inside the object, at predetermined positions corresponding to the portions to be treated.
Inventors:
FUKUMITSU KENSHI (JP)
Application Number:
PCT/JP2004/010224
Publication Date:
January 27, 2005
Filing Date:
July 16, 2004
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
FUKUMITSU KENSHI (JP)
FUKUMITSU KENSHI (JP)
International Classes:
B23K26/00; B23K26/03; B23K26/36; B23K26/40; B28D1/22; B28D5/00; H01L21/301; (IPC1-7): B23K26/36; B28D5/00; H01L21/301
Domestic Patent References:
| WO2002022301A1 | 2002-03-21 |
Foreign References:
| JP2003154517A | 2003-05-27 |
Other References:
ARAI, K.: "Handotai Wafer ni Okeru Laser Dicing Kako", JOURNAL OF THE JAPAN SOCIETY OF GRIDING ENGINEERS, vol. 47, no. 5, May 2003 (2003-05-01), pages 229 - 231, XP002985640
See also references of EP 1649965A4
See also references of EP 1649965A4
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6, Ginza 1-chome, Chuo-k, Tokyo 61, JP)
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