Title:
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/030802
Kind Code:
A1
Abstract:
Disclosed is a laser processing device and laser processing method having a high processing speed and high energy efficiency. By means of the light axis (O) of a focusing lens (21) being moved relatively along a line (S0) to be cut on a member (3) to be cut and thereby radiating focused laser light onto the member (3) to be cut, the laser processing method forms along the line (S0) to be cut and on the inside of the member (3) to be cut a modification region that is to be the starting point of cutting, and the laser processing method is characterized by simultaneously forming at locations that are a predetermined depth from the surface (3a) of the member (3) to be cut a plurality of cross-sectional focused spots (P0, P1..) over a cross section (3b) that is parallel to the surface (3a) and perpendicular to the light axis (O) of the focusing lens (21), and at that time, forming at least one cross-sectional focused spot of the plurality of cross-sectional focused spots (P0, P1..) over the projection line to the cross section (3b) of the line (S0) to be cut, thus forming one or a plurality of the aforementioned inside modification regions having a desired shape.
Inventors:
ATSUMI, Takafumi (1 Asahi-machi 2-chome, Kariya-sh, Aichi 50, 〒4488650, JP)
渥美 貴文 (〒50 愛知県刈谷市朝日町２丁目１番地 アイシン精機株式会社内 Aichi, 〒4488650, JP)
IKEDA, Yuji (61-112 Iwakura-Kitaikeda-cho Sakyo-ku, Kyoto-sh, Kyoto 04, 〒6060004, JP)
渥美 貴文 (〒50 愛知県刈谷市朝日町２丁目１番地 アイシン精機株式会社内 Aichi, 〒4488650, JP)
IKEDA, Yuji (61-112 Iwakura-Kitaikeda-cho Sakyo-ku, Kyoto-sh, Kyoto 04, 〒6060004, JP)
Application Number:
JP2010/065448
Publication Date:
March 17, 2011
Filing Date:
September 01, 2010
Export Citation:
Assignee:
AISIN SEIKI KABUSHIKI KAISHA (1 Asahi-machi 2-chome, Kariya-shi Aichi, 50, 〒4488650, JP)
アイシン精機株式会社 (〒50 愛知県刈谷市朝日町２丁目１番地 Aichi, 〒4488650, JP)
ATSUMI, Takafumi (1 Asahi-machi 2-chome, Kariya-sh, Aichi 50, 〒4488650, JP)
渥美 貴文 (〒50 愛知県刈谷市朝日町２丁目１番地 アイシン精機株式会社内 Aichi, 〒4488650, JP)
アイシン精機株式会社 (〒50 愛知県刈谷市朝日町２丁目１番地 Aichi, 〒4488650, JP)
ATSUMI, Takafumi (1 Asahi-machi 2-chome, Kariya-sh, Aichi 50, 〒4488650, JP)
渥美 貴文 (〒50 愛知県刈谷市朝日町２丁目１番地 アイシン精機株式会社内 Aichi, 〒4488650, JP)
International Classes:
B23K26/38; B23K26/04; B23K26/067; B23K26/40; B28D5/00; H01L21/301; C03B33/09
Attorney, Agent or Firm:
OHKAWA, Hiroshi (2-5 Meieki 3-chome, Nakamura-ku Nagoya-sh, Aichi 02, 〒4500002, JP)
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