Title:
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/114593
Kind Code:
A1
Abstract:
This laser processing method involves: a mark position measurement step in which a material substrate (4) for laser processing is mounted on a processing stage and the positions of the positioning marks are measured by means of imaging positioning marks (11) formed on the material substrate; a strain information acquisition step in which strain information relating to strain in the material substrate is acquired from the measurement results in the mark position measurement step; and a position adjusting step in which, in order to correct misalignment of laser processing due to strain in the material substrate, the advancement direction of the laser incident to the processing region of the material substrate is adjusted in accordance with the strain information. In the strain information acquisition step, strain information is acquired in units consisting of discrete regions (12-1 to 12-4) configured by partitioning the processing region (10), and in the position adjusting step, the advancement direction can be adjusted for each discrete region.
Inventors:
KANEDA ATSUHIRO (JP)
Application Number:
PCT/JP2012/052287
Publication Date:
August 08, 2013
Filing Date:
February 01, 2012
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
KANEDA ATSUHIRO (JP)
KANEDA ATSUHIRO (JP)
International Classes:
B23K26/00; B23K26/02; B23K26/08; H05K3/00
Foreign References:
| JP2008279470A | 2008-11-20 | |||
| JPH026183U | 1990-01-16 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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