Title:
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/059730
Kind Code:
A1
Abstract:
A laser processing method having: a first piercing step wherein a non-penetrating piercing hole running from the top surface of a workpiece (W) to the central portion thereof is formed; a cooling step wherein the workpiece (W) is cooled; a second piercing step wherein the piercing hole is formed through to the bottom surface of the workpiece; and a cutting step wherein the workpiece is cut. In the second piercing step the piercing process is performed by irradiating the workpiece (W) with a laser beam (L) while changing from a state in which the output of the laser beam (L) is set to a second output value smaller than a first output value, the focal position is set to a first in-focus position, the focal depth is set to a second depth larger than a first depth, and a side gas blowing pressure is set to a second pressure value smaller than a first pressure value, to a state wherein the output of the laser beam (L) is set to a third output value smaller than the first output value and larger than the second output value, the focal position is set to a second in-focus position having a larger in-focus amount than the first in-focus position, and the focal depth is set to a third depth larger than the second depth. Thus, self-burning during beam irradiation is suppressed, and the time required for the piercing process is reduced.
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Inventors:
KANO JUNJI (JP)
Application Number:
PCT/JP2014/077753
Publication Date:
April 21, 2016
Filing Date:
October 17, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/382; B23K26/064; B23K26/14; B23K26/38
Foreign References:
| JP2013208631A | 2013-10-10 | |||
| JP2012000678A | 2012-01-05 | |||
| JP2009136886A | 2009-06-25 | |||
| JP2007075878A | 2007-03-29 | |||
| JPH09206975A | 1997-08-12 | |||
| US20070000875A1 | 2007-01-04 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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