Title:
LASER PROCESSING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/070055
Kind Code:
A1
Abstract:
A laser processing method, in which: laser light from a fiber laser or a direct diode laser is radiated from a nozzle to an iron plate material; a nozzle having a nozzle opening part of an opening diameter set in advance in accordance with the thickness of the plate material is selected from a plurality of nozzles each having a nozzle opening part of different opening diameters, and used; an assist gas is discharged from the nozzle opening part towards the plate material while the laser light is radiated at the plate material; and the plate material is cut.
Inventors:
MIZOGUCHI YUYA (JP)
ISHIGURO HIROAKI (JP)
ITO RYOHEI (JP)
KOBAYASHI RYO (JP)
MASUDA KENJI (JP)
ISHIGURO HIROAKI (JP)
ITO RYOHEI (JP)
KOBAYASHI RYO (JP)
MASUDA KENJI (JP)
Application Number:
PCT/JP2018/037371
Publication Date:
April 11, 2019
Filing Date:
October 05, 2018
Export Citation:
Assignee:
AMADA HOLDINGS CO LTD (JP)
International Classes:
B23K26/70; B23K26/38
Domestic Patent References:
| WO2010137475A1 | 2010-12-02 | |||
| WO2016093053A1 | 2016-06-16 | |||
| WO2017145518A1 | 2017-08-31 |
Foreign References:
| JP2015213939A | 2015-12-03 | |||
| JP2017109238A | 2017-06-22 | |||
| JPS5919356B2 | 1984-05-04 | |||
| JP2017131897A | 2017-08-03 | |||
| JPH0584590A | 1993-04-06 |
Other References:
See also references of EP 3693125A4
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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