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Patent Searching and Data


Title:
LASER PROCESSING METHOD AND LASER PROCESSING MACHINE
Document Type and Number:
WIPO Patent Application WO/2019/077875
Kind Code:
A1
Abstract:
The purpose of the present invention is to determine the position of generation of a shockwave in an assist gas (AG) freely ejected from a nozzle (2b) used for cutting a work using laser light. In an entire gap range (Ga) that can be set as a gap (G) which is a distance between a distal end of the nozzle (2b) and a surface of a work (W), an appropriate gap range (G1) that does not include at least the position of generation of a shockwave is set. The work (W) is cut with the gap (G) being set to a value within the appropriate gap range (G1).

Inventors:
MIYOSHI HIRONOBU (JP)
KAMIYAMA TAKAYUKI (JP)
Application Number:
PCT/JP2018/031140
Publication Date:
April 25, 2019
Filing Date:
August 23, 2018
Export Citation:
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Assignee:
AMADA HOLDINGS CO LTD (JP)
International Classes:
B23K26/38; B23K26/14
Foreign References:
JPH09168885A1997-06-30
JP2009154189A2009-07-16
JP2011041963A2011-03-03
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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