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Title:
LASER PROCESSING METHOD, AND METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/155229
Kind Code:
A1
Abstract:
Disclosed is a laser processing method wherein a via hole is formed with a smallest possible number of shots without having a resin residual in the via hole and generating deformation and penetration of an inner layer circuit pattern exposed in the via hole. In the laser processing method, via holes (23, 24) are formed by removing a layer to be processed that includes: a flexible insulating base (1) having conformal masks (7, 8a) formed on the surface; and an adhesive layer (12), which is provided below the insulating base, and which has a light absorption degree higher than that of the insulating base material (1), and a decomposition temperature lower than that of the insulating base material (1) in the wavelength region of a processing laser beam. After applying one shot of pulsed light having a first energy density, with which deformation and penetration of a conductive film (2A) are not caused, and with which the insulating base material (1) can be removed by one shot, pulsed light having a second energy density smaller than the first energy density is applied, said second energy density being a density with which the remaining layer to be processed can be removed with a predetermined number of shots without causing deformation and penetration of the conductive film (2A).

Inventors:
MATSUDA Fumihiko (12-15, Shiba-Daimon 1-chome, Minato-k, Tokyo 85, 〒1058585, JP)
松田 文彦 (〒85 東京都港区芝大門一丁目12番15号 日本メクトロン株式会社内 Tokyo, 〒1058585, JP)
Application Number:
JP2011/051986
Publication Date:
December 15, 2011
Filing Date:
February 01, 2011
Export Citation:
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Assignee:
NIPPON MEKTRON, LTD. (12-15, Shiba-Daimon 1-chome Minato-k, Tokyo 85, 〒1058585, JP)
日本メクトロン株式会社 (〒85 東京都港区芝大門一丁目12番15号 Tokyo, 〒1058585, JP)
MATSUDA Fumihiko (12-15, Shiba-Daimon 1-chome, Minato-k, Tokyo 85, 〒1058585, JP)
International Classes:
B23K26/38; B23K26/00; B23K26/40; H05K3/00; H05K3/46; B23K101/42
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (Kyowa Patent & Law Office, Room 323 Fuji Bldg., 2-3, Marunouchi 3-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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Claims:



 
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