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Patent Searching and Data


Title:
LASER PROCESSING METHOD AND LASER PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/146021
Kind Code:
A1
Abstract:
This laser processing method for performing laser processing on a transparent material that is transparent to ultraviolet radiation comprises the following steps: A. a positioning step for performing positioning so that the transfer position of a transfer image is positioned inside the transparent material at a predetermined depth ΔZsf in the optical axis direction from the surface of the transparent material; B. an irradiation condition acquisition step; C. a determination step for determining, on the basis of an irradiation condition, whether the maximum fluence of pulse laser light on the surface of the transparent material is within a predetermined range; and D. a control step for allowing irradiation of the pulse laser light when the maximum fluence is determined to be within the predetermined range. Here, a target fluence is the average fluence in a beam cross-section at the transfer position, the beam cross-section being in a direction perpendicular to the optical axis of the pulse laser light, and the maximum fluence is the maximum value among the respective fluence values of a plurality of small regions obtained by partitioning a beam cross-section on the surface of the transparent material into the small regions.

Inventors:
SUWA AKIRA (JP)
KAKIZAKI KOUJI (JP)
KOBAYASHI MASAKAZU (JP)
WAKABAYASHI OSAMU (JP)
Application Number:
PCT/JP2018/002152
Publication Date:
August 01, 2019
Filing Date:
January 24, 2018
Export Citation:
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Assignee:
GIGAPHOTON INC (JP)
International Classes:
B23K26/02; B23K26/00; B23K26/382; B23K26/50
Foreign References:
JP2006297478A2006-11-02
JP2016528048A2016-09-15
JPH0532428A1993-02-09
JPH10113780A1998-05-06
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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