Title:
LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2004/016387
Kind Code:
A1
Abstract:
A laser processing method capable of promoting the clearance of substances removed from a work piece to be processed during processing so as to enhance processing capability. From one side (front face (2a)) of a work piece (2) to be processed through which work piece laser light can be transmitted, very short pulse laser light (L) is applied to the work piece (2). The very short pulse laser light (L) applied is transmitted through the one side (front face (2a)) of the work piece (2) to be processed and condensed on the other side (rear face (2b)), and the work piece (2) is processed from the face or vicinity of the face on the other side (rear face (2b)).
Inventors:
KOITO SHIGEYUKI (JP)
Application Number:
PCT/JP2003/009896
Publication Date:
February 26, 2004
Filing Date:
August 04, 2003
Export Citation:
Assignee:
NAMIKI PRECISION JEWEL CO LTD (JP)
KOITO SHIGEYUKI (JP)
KOITO SHIGEYUKI (JP)
International Classes:
B23K26/00; B23K26/046; B23K26/16; B23K26/382; B23K26/40; C04B41/91; (IPC1-7): B23K26/40
Domestic Patent References:
| WO2002022301A1 | 2002-03-21 |
Foreign References:
| JP2002160079A | 2002-06-04 | |||
| EP0863231A1 | 1998-09-09 | |||
| JP2001259868A | 2001-09-25 |
Download PDF: