Title:
LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2008/004395
Kind Code:
A1
Abstract:
In the case of forming a plurality of rows of modified regions, in the thickness
direction of a processing object, along a line to be cut, a first modified region
closest to a first surface and a second modified region closest to a second surface
are accurately formed. In a laser processing method, laser beams are applied
by having a light collecting point inside the processing object (1), and the modified
regions (M1-M6) to be starting points of cutting are formed, in the thickness
direction of the processing object (1), along the line (5) to be cut on the processing
object (1). Among the modified regions (M1-M6), the modified region (M6) closest
to a rear surface (21) is formed by having the position of the rear surface (21)
as reference, and the modified region (M1) closest to the front surface (11a)
is formed by having the position of the front surface (11a) as reference. Thus,
even when the thickness of the processing object (1) varies, shift of the position
of the modified region (M6) and that of the position of the modified region (M1)
due to changes of the thickness of the processing object (1) are suppressed.
Inventors:
OSAJIMA, Tetsuya (1126-1 Ichino-cho,Hamamatsu-sh, Shizuoka 58, 4358558, JP)
Application Number:
JP2007/061476
Publication Date:
January 10, 2008
Filing Date:
June 06, 2007
Export Citation:
Assignee:
HAMAMATSU PHOTONICS K.K. (1126-1, Ichino-cho Higashi-ku, Hamamatsu-sh, Shizuoka 58, 4358558, JP)
浜松ホトニクス株式会社 (〒58 静岡県浜松市東区市野町１１２６番地の１ Shizuoka, 4358558, JP)
浜松ホトニクス株式会社 (〒58 静岡県浜松市東区市野町１１２６番地の１ Shizuoka, 4358558, JP)
International Classes:
B23K26/38; B23K26/06; B23K26/40; B28D5/00; C03B33/09; H01L21/301; B23K101/40
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (SOEI PATENT AND LAW FIRM, Ginza First Bldg. 10-6Ginza 1-chome, Chuo-k, Tokyo 61, 1040061, JP)
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