Title:
LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/152230
Kind Code:
A1
Abstract:
Provided is a laser processing method capable of increasing splitting force according to the required quality. By irradiating an object to be processed with laser light (L) having a pulse waveform with a half-value width and a bottom width that are equal to each other, a plurality of modified spots are formed along a planned cut line in the object to be processed, and a modified region is formed by the plurality of modified spots. A laser light source (101) controls a drive power source (51) by a laser light source control unit (102) to switch the pulse waveform between first to third pulse waveforms according to the PE value of the laser light (L). When the PE value is low, the first pulse waveform configured to have a peak value located on the first half side thereof and a saw-edged shape is set as the pulse waveform, and when the PE value is high, the second pulse waveform configured to have a peak value located on the second half side thereof and a saw-edged shape is set as the pulse waveform.
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Inventors:
SUGIURA RYUJI (JP)
Application Number:
PCT/JP2011/061674
Publication Date:
December 08, 2011
Filing Date:
May 20, 2011
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
SUGIURA RYUJI (JP)
SUGIURA RYUJI (JP)
International Classes:
B23K26/073; B23K26/38; B23K26/40; B23K26/53; B28D5/00; C03B33/09; H01L21/301
Domestic Patent References:
| WO2010116917A1 | 2010-10-14 |
Foreign References:
| JP2008246578A | 2008-10-16 | |||
| JP2006108459A | 2006-04-20 | |||
| JP2006108459A | 2006-04-20 |
Other References:
See also references of EP 2578349A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims: