Title:
LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/048109
Kind Code:
A1
Abstract:
This laser processing method includes a preparation step and a processing step. In the preparation step, a workpiece (100) being processed is placed at a processing position. In the processing step, the workpiece (100) placed at the processing position is irradiated with a pulse laser transmitted through a light-scanning device from a processing head (13), and a plurality of holes are formed in the workpiece (100). The pulse laser is scanned by the light-scanning device, whereby a process in which the position at which the pulse laser is radiated changes sequentially from an initial position to an ending position at a scanning speed and then returns to the initial position is periodically repeated. In the processing step, the position at which the pulse laser is radiated with respect to the workpiece is changed at approximately the same speed and in the opposite direction as scanning of the pulse laser by the light-scanning device, whereby substantially the same location on the workpiece (100) is irradiated with the pulse laser over a single cycle.
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Inventors:
NAKAZAWA MUTSUHIRO
Application Number:
PCT/JP2022/034866
Publication Date:
March 30, 2023
Filing Date:
September 20, 2022
Export Citation:
Assignee:
KAWASAKI HEAVY IND LTD (JP)
International Classes:
B23K26/082; B23K26/382; G02B26/10
Domestic Patent References:
| WO2020050148A1 | 2020-03-12 |
Foreign References:
| JPH0329708B2 | 1991-04-25 | |||
| JPS5978793A | 1984-05-07 | |||
| JPH01321422A | 1989-12-27 |
Attorney, Agent or Firm:
KATSURAGAWA, Naoki (JP)
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