Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/186627
Kind Code:
A1
Abstract:
Disclosed is a laser processing method. The disclosed laser processing method simultaneously enables height measurement and laser processing of an object to be processed, by using a height measurement unit and a laser irradiation unit which are arranged in the direction of processing.

Inventors:
YOON TAE JAE (KR)
LEE JAE YOUNG (KR)
KIM KI HO (KR)
CHOI DA BIN (KR)
Application Number:
PCT/KR2018/003777
Publication Date:
October 11, 2018
Filing Date:
March 30, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EO TECHNICS CO LTD (KR)
International Classes:
B23K26/04; B23K26/03; B23K26/08
Foreign References:
JP2008119718A2008-05-29
JP2017013092A2017-01-19
KR20140141455A2014-12-10
KR101181204B12012-09-18
KR101060879B12011-08-31
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: DISPLAY DEVICE CONFIGURING MULTI DISPLAY SYSTEM AND CONTROL METHOD THEREOF

Next Patent: ROTARY ENGINE