Title:
LASER PROCESSOR, PROCESSING EQUIPMENT, SET-UP DEVICE, PROGRAM, AND SET-UP METHOD
Document Type and Number:
WIPO Patent Application WO/2017/163419
Kind Code:
A1
Abstract:
This laser processor cuts a workpiece (W) into a plurality of parts (PT) and a bed material (BM). The laser processor is provided with: a workpiece support component (10) that has a plurality of support components (11) placed at intervals and supporting the workpiece (W); a processing head for irradiating the workpiece (W) with laser light; a relative movement component that moves the processing head and the workpiece support component (10) relative to each other; and a control device that controls the relative movement component and the processing head and cuts the workpiece (W). The control device, while cutting the workpiece (W), forms a joint (J) that connects both the parts (PT) that will fall from atop the support components (11) after cutting, and the parts (PT) that cannot be suctioned by a carrying and suction means after cutting, to a partial bed material (PBM), which is a portion of the bed material (BM). The control device also regulates the falling of the parts (PT) and the partial bed material (PBM) from atop the support components (11), and enables suction using the carrying and suction means.
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Inventors:
KOSHIMAE TOSHIKI (JP)
TAKADA HIROKO (JP)
MIYAZAKI TAKANORI (JP)
YAMAMOTO HIBIKI (JP)
TAKADA HIROKO (JP)
MIYAZAKI TAKANORI (JP)
YAMAMOTO HIBIKI (JP)
Application Number:
PCT/JP2016/059719
Publication Date:
September 28, 2017
Filing Date:
March 25, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/38; B23K26/08; B23K26/10; B23K26/60
Foreign References:
| JP2013180314A | 2013-09-12 | |||
| JP2012509177A | 2012-04-19 | |||
| JP2004261843A | 2004-09-24 | |||
| JP2001334379A | 2001-12-04 | |||
| JPH09271977A | 1997-10-21 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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