Title:
LASER RELEASE LAMINATE, COMPOSITION, AND KIT
Document Type and Number:
WIPO Patent Application WO/2020/080276
Kind Code:
A1
Abstract:
This laminate includes an adhesive layer and a release layer having an adhesiveness that decreases with the irradiation of light, wherein the area ratio of a low light absorptive region in relation to the release layer is 0.32 pixels/cm2 or less when converted to 0.25 μm square pixels, the low light absorptive region reflecting light with a wavelength of 355 nm at a light intensity that is at least 5% greater than the mean value within the surface. In addition, the present invention relates to a composition and a kit related to this laminate.
Inventors:
MASUDA SEIYA (JP)
Application Number:
PCT/JP2019/040182
Publication Date:
April 23, 2020
Filing Date:
October 11, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/06; B23K26/40; B23K26/57
Domestic Patent References:
| WO2014050820A1 | 2014-04-03 |
Foreign References:
| JP2018145440A | 2018-09-20 | |||
| JP2017144615A | 2017-08-24 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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