Title:
LASER REMOVAL METHOD, METHOD FOR MANUFACTURING ROTARY ELECTRICAL MACHINE, AND LASER REMOVAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/175671
Kind Code:
A1
Abstract:
A laser removal method according to an embodiment involves using a laser beam to irradiate a filmy body formed on a substrate to remove the filmy body. The laser removal method comprises the steps of: irradiating a filmy body with a first laser beam and moving the irradiation position of the first laser beam to form a linear recess in the filmy body; and using a second laser beam to irradiate the filmy body, which is in a region defined by the linear recess. The first laser beam has a wavelength at which absorptivity with regard to the filmy body is higher than absorptivity with regard to the substrate. The second laser beam has a wavelength at which absorptivity with regard to the substrate is higher than absorptivity with regard to the filmy body.
Inventors:
KIKAWADA MASAKAZU (JP)
Application Number:
PCT/JP2022/011319
Publication Date:
September 21, 2023
Filing Date:
March 14, 2022
Export Citation:
Assignee:
TOSHIBA KK (JP)
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORP (JP)
TOSHIBA IND PRODUCTS & SYSTEMS CORP (JP)
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORP (JP)
TOSHIBA IND PRODUCTS & SYSTEMS CORP (JP)
International Classes:
B23K26/36
Domestic Patent References:
| WO2021153663A1 | 2021-08-05 |
Foreign References:
| JP2010045936A | 2010-02-25 | |||
| JP2020184624A | 2020-11-12 | |||
| JP2019155375A | 2019-09-19 |
Attorney, Agent or Firm:
HYUGAJI, Masahiko et al. (JP)
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