Title:
LASER SOLDERING DEVICE, CONTROL DEVICE, AND LASER SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/254807
Kind Code:
A1
Abstract:
[Problem] To provide a laser soldering device, a control device, and a laser soldering method that enable high quality soldering by laser irradiation. [Solution] A laser soldering device according to the present technology comprises a laser light source, a spatial light modulator (SLM), and a control unit. The laser light source emits laser light. The SLM modulates the laser light incident from the laser light source, and irradiates at least one of solder and an object to be soldered, with the laser light. The control unit controls the laser light source and the SLM, and adjusts an irradiation condition of the laser light.
Inventors:
HOSONO HIROYUKI (JP)
SUGIYAMA YUTAKA (JP)
JITSUKAWA KEIJI (JP)
SAWADA KENTARO (JP)
MOTEKI DAISUKE (JP)
KAJIO YUSUKE (JP)
SUGIYAMA YUTAKA (JP)
JITSUKAWA KEIJI (JP)
SAWADA KENTARO (JP)
MOTEKI DAISUKE (JP)
KAJIO YUSUKE (JP)
Application Number:
PCT/JP2022/006309
Publication Date:
December 08, 2022
Filing Date:
February 17, 2022
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
B23K1/005; B23K1/00
Foreign References:
| EP1372016A2 | 2003-12-17 | |||
| US20200251442A1 | 2020-08-06 | |||
| JP2019161153A | 2019-09-19 | |||
| JP2020025985A | 2020-02-20 | |||
| JPH06201325A | 1994-07-19 | |||
| JP2008277406A | 2008-11-13 | |||
| JP2018187638A | 2018-11-29 | |||
| JP2013515612A | 2013-05-09 |
Attorney, Agent or Firm:
MINAMI AOYAMA PATENT AND TRADEMARK ATTORNEYS (JP)
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