Title:
LASER SOLDERING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/199086
Kind Code:
A1
Abstract:
[Problem] To provide a laser soldering technique with which it is possible to prevent scorching, residue, etc., in a substrate or in surrounding heat-sensitive components. [Solution] Provided is an automatic soldering method in which there is used an automatic soldering device 40 comprising a laser soldering device 1 and a Z-axis drive device 43, wherein the method is characterized by including: a step for causing the height of the laser soldering device 1 to match a position where the irradiation diameter D1 of laser light reaches a pre-set size that is greater than the diameter of a solder drop S; a step for irradiating the solder drop S with the laser light to volatilize a flux solvent component and heating at a temperature at which a solder powder does not melt; a step for causing the height of the laser soldering device to match a position where the irradiation diameter D2 of the laser light reaches a pre-set size that is less than the diameter of the solder drop S; and a step for irradiating the solder drop S with the laser light, heating at a temperature at which the solder powder melts, and performing soldering. Also provided is a device for said automatic soldering method.
Inventors:
IKUSHIMA KAZUMASA (JP)
Application Number:
PCT/JP2018/016599
Publication Date:
November 01, 2018
Filing Date:
April 24, 2018
Export Citation:
Assignee:
MUSASHI ENG INC (JP)
International Classes:
B23K1/005; H05K3/34
Foreign References:
| JPS60180666A | 1985-09-14 | |||
| JP2008173659A | 2008-07-31 | |||
| JP2007067165A | 2007-03-15 | |||
| JPS61263296A | 1986-11-21 | |||
| JPH0818125A | 1996-01-19 |
Other References:
See also references of EP 3616819A4
Attorney, Agent or Firm:
SUDO, Akinobu et al. (JP)
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