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Title:
LASER SOLDERING REPAIRING PROCESS, LASER SOLDERING PROCESS AND LASER SOLDERING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/142150
Kind Code:
A1
Abstract:
Disclosed are a laser soldering repairing process, a laser soldering process and a laser soldering system. The laser soldering repairing process is a repairing process performed, by means of a laser, on a repair area on which a soldering process has not been performed of a solder area on a substrate. The laser soldering repairing process comprises the steps of: performing laser cleaning by means of radiating a cleaning laser beam on a repair area of a substrate; preparing a solder ball on the cleaned repair area of the substrate; and radiating a soldering laser beam on the solder ball and thus heating the solder ball and attaching same to the repair area.

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Inventors:
JUNG DAE HO (KR)
CHUNG TAI O (KR)
Application Number:
PCT/KR2016/009771
Publication Date:
August 24, 2017
Filing Date:
September 01, 2016
Export Citation:
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Assignee:
EO TECHNICS CO LTD (KR)
International Classes:
H01L23/00; H01L21/02; H01L21/268; H01L21/324; H01L21/67; H01L23/492; H01L23/495
Foreign References:
JP2009177015A2009-08-06
JP2002076043A2002-03-15
JP2010044030A2010-02-25
KR20130109301A2013-10-08
KR20050109131A2005-11-17
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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