Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LATENT HEAT STORAGE MATERIAL-CONTAINING RESIN COMPOSITION AND UTILIZATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/221006
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel latent heat storage material-containing resin composition that has a stable melting temperature, high durability and excellent handling properties with minimized leakage risk. To solve this problem, provided is a latent heat storage material-containing resin composition wherein a gel-type inorganic latent heat storage material composition, said composition not undergoing solid-liquid separation when heated to a temperature exceeding the melting temperature, is dispersed in a liquid reaction curable resin, characterized in that the inorganic latent heat storage material composition contains a thickener.

Inventors:
KATANO CHIAKI (JP)
Application Number:
PCT/JP2019/018590
Publication Date:
November 21, 2019
Filing Date:
May 09, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KANEKA CORP (JP)
International Classes:
C09K5/06; C08J3/20; C08K3/01; C08K3/16; C08K13/00; C08L101/00; E04B1/76
Domestic Patent References:
WO2016204284A12016-12-22
Foreign References:
JPS60202183A1985-10-12
JPS61111389A1986-05-29
JPH0260986A1990-03-01
JP2006225474A2006-08-31
JP2004307772A2004-11-04
JP2004269574A2004-09-30
JP2005249377A2005-09-15
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Download PDF: