Title:
LAYERED ADHESIVE FILM FOR INSERT MOLDING, METHOD FOR MANUFACTURING INSERT MOLDED ARTICLE, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2015/152323
Kind Code:
A1
Abstract:
The present invention addresses the problem of improving adhesion in a layered adhesive film for insert molding, in which a thermoplastic resin film and an adhesive film comprising a modified polyolefin resin are layered. The present invention is a layered adhesive film for insert molding, in which a thermoplastic resin film (F2) and an adhesive film (F1) comprising a resin composition containing a modified polyolefin resin graft-modified using a monomer having an ethylenic double bond and an epoxy group in the same molecule are layered, the layered adhesive film for insert molding characterized in that 1) the total thickness of the layered adhesive film for insert molding is less than 75 µm, and 2) the thickness of the adhesive film (F1) is equal to or less than the thickness of the thermoplastic resin film (F2).
Inventors:
SUGIYAMA TAKESHI (JP)
Application Number:
PCT/JP2015/060326
Publication Date:
October 08, 2015
Filing Date:
April 01, 2015
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B32B7/10; B32B27/32; C08F8/08; C09J7/10; C09J123/26; C09J151/06
Domestic Patent References:
| WO2012060311A1 | 2012-05-10 |
Foreign References:
| JP2013091269A | 2013-05-16 | |||
| JP2013091268A | 2013-05-16 | |||
| JP2009126922A | 2009-06-11 | |||
| JP2009113485A | 2009-05-28 | |||
| JPH10329259A | 1998-12-15 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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