Title:
LAYERED BODY, MANUFACTURING METHOD THEREFOR, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2019/151293
Kind Code:
A1
Abstract:
This layered body comprises, in the order given, the following: a first resin layer formed of a resin A; a conductive layer; and a second resin layer formed of a resin B. The storage elastic modulus of resin A at 25ºC is 500MPa to 20000MPa. The storage elastic modulus of resin B at 25ºC is 10MPa to 1000MPa.
Inventors:
MIURA TAKUYA (JP)
Application Number:
PCT/JP2019/003087
Publication Date:
August 08, 2019
Filing Date:
January 30, 2019
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
B32B7/02; G06F3/041
Domestic Patent References:
| WO2018003713A1 | 2018-01-04 | |||
| WO2016152871A1 | 2016-09-29 |
Foreign References:
| US20170147117A1 | 2017-05-25 | |||
| JP2007328092A | 2007-12-20 | |||
| JP2007086771A | 2007-04-05 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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