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Patent Searching and Data


Title:
LAYERED BODY AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/079678
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a layered body and an application thereof (method for manufacturing an electronic component, or the like) the layered body having, on a substrate, a gel layer that is more suitable for an industrial production step and which, prior to curing thereof, is capable of protecting the substrate from various types of processing prior to curing, has excellent heat resistance and other properties, low elastic modulus, low stress, and excellent stress buffer properties and flexibility, and is soft and has excellent retention of an electronic component or the like, the gel layer having higher shape retention after curing thereof than before curing thereof and changing to a hard cured layer having excellent release properties, and the cured layer be easily and conveniently separable from the substrate even when localized. [Solution] A layered body and an application thereof, the layered body in which a curing reactive silicone gel is layered, and a sheet-shaped member is provided that is layered via an adhesive layer on the curing reactive silicone gel.

Inventors:
FUKUI Hiroshi (2-2, Chigusakaiga, Ichihara-shi Chiba 08, 〒2990108, JP)
TOYAMA Kyoko (2-2, Chigusakaiga, Ichihara-shi Chiba 08, 〒2990108, JP)
USHIO Yoshito (2-2, Chigusakaiga, Ichihara-shi Chiba 08, 〒2990108, JP)
Application Number:
JP2017/038775
Publication Date:
May 03, 2018
Filing Date:
October 26, 2017
Export Citation:
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Assignee:
DOW CORNING TORAY CO., LTD. (5-1 Otemachi 1-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
B32B27/00; B32B7/02; B32B7/12; C08L83/05; C08L83/07; C09J183/04; H01L21/301
Foreign References:
JP2012028666A2012-02-09
JP2010012673A2010-01-21
JP2008162240A2008-07-17
JP2014534296A2014-12-18
JPH1112546A1999-01-19
JP2013129754A2013-07-04
JP2010159411A2010-07-22
JP2013067054A2013-04-18
JP2008045091A2008-02-28
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