LAYERED BODY FOR PTP OR BLISTER PACK, AND PTP OR BLISTER PACK

WIPO Patent Application WO/2013/140821

A1

Provided is a layered body (40) for a PTP or blister pack in which an absorption layer (50) is layered on a substrate layer (70) via an adhesive layer (60). The absorption layer (50) has a configuration in which an outer skin layer (52), an intermediate layer (51), and an inner skin layer (53) are layered in the stated sequence, and the outer skin layer (52) is bonded to the substrate layer (70) via the adhesive layer (60). The outer skin layer (52) is composed of a polyethylene resin, the intermediate layer (51) is composed of a mixture of a polyethylene resin and an absorbent, and the inner skin layer (53) is composed of a blended resin having 25 to 50 mass% of a linear low-density polyethylene, and 75 to 50 mass% of a high-density polyethylene having a higher melting point as a material than the preheating temperature in the molding process. Preferably, the blended resin of the inner skin layer (53) has 10 to 50 mass% of a linear low-density polyethylene, and 90 to 50 mass% of a high-density polyethylene having a higher melting point as a material than the preheating temperature in the molding process.

TAKAHASHI MASAAKI (JP)
TANIGUCHI HIROSHI (JP)
OGAWA TATSUYA (JP)
KOIZUMI SHINICHI (JP)
YAMAMOTO HIKARU (JP)
FUJISAKI MIDORI (JP)

PCT/JP2013/001972

September 26, 2013

March 22, 2013

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DAIICHI SANKYO CO LTD (JP)
KYODO PRINTING CO LTD (JP)

B65D65/40; A61J1/10; B32B27/18; B32B27/32; B65D75/34; B65D75/36; B65D81/26; B65D83/04

WO2008050714A1	2008-05-02
WO2012029899A1	2012-03-08
WO2006115264A1	2006-11-02

JPH03182348A	1991-08-08
JPH09308683A	1997-12-02
JP2006103737A	2006-04-20

YAMASAKI, TAKAHIRO (JP)
Takahiro Yamazaki (JP)

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