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Title:
LAYERED BODY FOR TEMPORARY BONDING, METHOD FOR MANUFACTURING LAYERED BODY FOR TEMPORARY BONDING, AND LAYERED BODY PROVIDED WITH DEVICE WAFER
Document Type and Number:
WIPO Patent Application WO/2015/190479
Kind Code:
A1
Abstract:
　Provided is a layered body for temporary bonding, whereby temporary bonding of a device wafer and a support body can easily be removed, a method for manufacturing a layered body for temporary bonding, and a layered body provided with a device wafer. This layered body for temporary bonding is used for temporarily and peelably bonding a support body and a device face of a device wafer, and has a thermoplastic resin film and a layer including a release agent selected from a compound having a siloxane bond and a compound having a silicon atom and a fluorine atom, and also has at least a layer including the release agent in a region of the device-facing surface of the thermoplastic resin film that corresponds to the device face. When the support body is peeled from the device face of the device wafer after the device wafer and the support body are temporarily bonded, the layered body including at least the support body and the thermoplastic resin film is peeled from the device.

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Inventors:
KAMOCHI YOSHITAKA (JP)
KOYAMA ICHIRO (JP)
IWAI YU (JP)
SAWANO MITSURU (JP)
NAKAMURA ATSUSHI (JP)
Application Number:
PCT/JP2015/066596
Publication Date:
December 17, 2015
Filing Date:
June 09, 2015
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J7/10; C09J201/00; H01L21/683
Domestic Patent References:
WO2015079863A12015-06-04
WO2014003056A12014-01-03
WO2013119976A12013-08-15
Foreign References:
JP2013241568A2013-12-05
JP2013235919A2013-11-21
JP2013222761A2013-10-28
JP2011225814A2011-11-10
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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