Title:
LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2020/226062
Kind Code:
A1
Abstract:
This layered body comprises a polyimide film tightly adhered onto a glass substrate or a silicon substrate, and a metal film or an oxide semiconductor film further layered over the polyimide film. The thickness of the metal film or the oxide semiconductor film is 1 to 400 nm, and the moisture content of the polyimide film is 1,000 to 35,000 ppm by mass.
Inventors:
HOSHINO SHUN (JP)
MURAYAMA TOMOHISA (JP)
ABIKO YOHEI (JP)
MITADERA JUN (JP)
MURAYAMA TOMOHISA (JP)
ABIKO YOHEI (JP)
MITADERA JUN (JP)
Application Number:
PCT/JP2020/017439
Publication Date:
November 12, 2020
Filing Date:
April 23, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B32B27/34; B32B17/10; B32B27/00
Domestic Patent References:
| WO2015041190A1 | 2015-03-26 | |||
| WO2018221374A1 | 2018-12-06 | |||
| WO2016043180A1 | 2016-03-24 |
Foreign References:
| JP2018144285A | 2018-09-20 | |||
| JP2016021384A | 2016-02-04 | |||
| JP2018145440A | 2018-09-20 | |||
| JP2016132103A | 2016-07-25 | |||
| JP2017197631A | 2017-11-02 | |||
| JP2004319869A | 2004-11-11 | |||
| JP2003147099A | 2003-05-21 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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