LAYERED COMPONENTS, MATERIALS, METHODS OF PRODUCTION AND USES THEREOF

WIPO Patent Application WO2003103020

A3

A layered component is described that includes: a substrate; a dielectric material having a plurality of pores, wherein the material is coupled to the substrate; and a diffusion blocking material coupled to the low k dielectric material, wherein the diffusion blocking material is attracted to the low k dielectric material. A layered material is also described that includes: a dielectric material having a plurality of pores, wherein each pore has a pore diameter; and a layer comprising a plurality of diffusion blocking particles, wherein the particles have a article size that is larger than the pore diameter. Methods of minimizing the diffusion of metal atoms into a material having a plurality of pores are further disclosed that include: providing a precursor material that comprises molecules having a molecule size that is larger than a pore diameter of any of the plurality of pores; providing a solvent carrier solution; combining the precursor material and the solvent carrier solution to form a diffusion blocking reactive solution; and applying the diffusion blocking reactive solution to a layer of porous material.

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JPH09293714	SELECTIVE OXIDIZING METHOD FOR SILICON SUBSTRATE
JP2003017664	MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

IWAMOTO NANCY (US)
THOMAS MICHAEL (US)

PCT/US2003/017656

June 03, 2004

June 03, 2003

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HONEYWELL INT INC (US)
IWAMOTO NANCY (US)
THOMAS MICHAEL (US)

H01L21/316; H01L21/768; H01L23/532; (IPC1-7): H01L21/31; B32B3/26; C07C13/28

US5965202A	1999-10-12
US6472705B1	2002-10-29
US6054379A	2000-04-25
US6423811B1	2002-07-23

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