Title:
LAYERED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAYERED ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/159482
Kind Code:
A1
Abstract:
Provided is a layered electronic component in which a shielding film is less likely to be separated from a surface of a laminated body. The present invention is provided with: a laminated body 1 which includes a plurality of stacked insulator layers and which has a bottom surface B, a top surface T, and a plurality of side surfaces S connecting the bottom surface B to the top surface T; and a shielding film 4 formed on the side surfaces S of the laminated body 1, wherein at least one metal structure 3 is formed on a ridge line portion where the side surfaces S and the bottom surface B of the laminated body 1 are in contact with each other, and a portion of the edge of the shielding film 4 is joined to the metal structure 3 directly or indirectly via a plating film formed on a surface of the metal structure 3.
Inventors:
MIYAHARA KUNIHIRO (JP)
Application Number:
PCT/JP2018/006666
Publication Date:
September 07, 2018
Filing Date:
February 23, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/36; H01F27/00; H01F41/04; H01G4/224; H01G4/30; H03H7/01; H05K9/00
Foreign References:
| JPH0696992A | 1994-04-08 | |||
| JP2015095496A | 2015-05-18 | |||
| JP2013098378A | 2013-05-20 | |||
| US20150364255A1 | 2015-12-17 | |||
| JPH11219837A | 1999-08-10 | |||
| JPH01295407A | 1989-11-29 | |||
| JPH113836A | 1999-01-06 |
Attorney, Agent or Firm:
KAWAMOTO, Takashi (JP)
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