Title:
LAYERED MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/047139
Kind Code:
A1
Abstract:
A layered molding device according to an embodiment of the present invention is provided with: an operation unit; a first surface; a movement unit; a supply unit; and an irradiation unit. The operation unit covers a part of a supply region to which powder material is supplied and which is oriented in a first direction, has first and second portions arranged in a second direction crossing the first direction, and has a first opening extending in the first direction between the first and second portions. The first surface is provided on the first portion so as to face the second portion, and has a second opening. The movement unit moves the operation unit with respect to the supply region. The supply unit supplies inert gas from the second opening into the first opening. The irradiation unit is provided in a position spaced apart from the operation unit, is capable of irradiating an energy line onto the supply region via the first opening, and is capable of changing the position onto which the energy line is irradiated.
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Inventors:
NAKANO HIDESHI (JP)
OHNO HIROSHI (JP)
WATASE AYA (JP)
MACHIDA MORIHIRO (JP)
IWAKAWA KAZUNARI (JP)
PAN SHANYING (JP)
OHNO HIROSHI (JP)
WATASE AYA (JP)
MACHIDA MORIHIRO (JP)
IWAKAWA KAZUNARI (JP)
PAN SHANYING (JP)
Application Number:
PCT/JP2016/059521
Publication Date:
March 23, 2017
Filing Date:
March 24, 2016
Export Citation:
Assignee:
TOSHIBA KK (JP)
International Classes:
B29C67/00; B33Y30/00
Foreign References:
| JP2002038201A | 2002-02-06 | |||
| JP2008255488A | 2008-10-23 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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