Title:
LAYERED RESIN FILM, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/145426
Kind Code:
A1
Abstract:
Provided is a feature for suppressing the occurrence of warping or peeling caused by changes in temperature, even in a structure that is not symmetrical about a transparent resin layer. This layered resin film has a stress mitigation layer formed from a cured product of a photocurable resin or a thermosetting resin, and an adhesive layer formed from a thermoplastic resin. The adhesive layer is layered on one or both sides of the stress mitigation layer and serves as the outermost layer. The glass transition temperature of the stress mitigation layer is equal to or less than 0°C.
Inventors:
KAWAKAMI REMI (JP)
Application Number:
PCT/JP2021/048608
Publication Date:
July 07, 2022
Filing Date:
December 27, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B17/10; B32B27/00; B32B27/30
Domestic Patent References:
| WO2019151329A1 | 2019-08-08 | |||
| WO2019151328A1 | 2019-08-08 | |||
| WO2016152735A1 | 2016-09-29 |
Foreign References:
| JP2018150563A | 2018-09-27 | |||
| JP2001234129A | 2001-08-28 | |||
| JPH0353831B2 | 1991-08-16 | |||
| JP2020219291A |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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